- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/76 - Making of isolation regions between components
Patent holdings for IPC class H01L 21/76
Total number of patents in this class: 2376
10-year publication summary
|
194
|
177
|
145
|
151
|
144
|
113
|
105
|
117
|
71
|
10
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
283 |
| Micron Technology, Inc. | 24960 |
117 |
| Samsung Electronics Co., Ltd. | 131630 |
116 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
109 |
| International Business Machines Corporation | 60644 |
75 |
| Applied Materials, Inc. | 16587 |
57 |
| United Microelectronics Corp. | 3921 |
55 |
| Texas Instruments Incorporated | 19376 |
49 |
| Fuji Electric Co., Ltd. | 4750 |
42 |
| Sony Semiconductor Solutions Corporation | 8770 |
41 |
| Tokyo Electron Limited | 11599 |
37 |
| Rohm Co., Ltd. | 5843 |
36 |
| Kioxia Corporation | 9847 |
31 |
| Intel Corporation | 45621 |
28 |
| Hynix Semiconductor Inc. | 2644 |
28 |
| Renesas Electronics Corporation | 6305 |
27 |
| Semiconductor Components Industries, L.L.C. | 5345 |
25 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
25 |
| SK Hynix Inc. | 11030 |
24 |
| Sony Corporation | 32931 |
22 |
| Other owners | 1149 |